标签：Submicron - 电子研发网

Submicron 7条

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Fluid Flow in Micron and Submicron Size Channels

Fluid Flow in Micron and Submicron Size Channels

/dl/488021.html

标签： Submicron Channels Micron Fluid

上传时间： 2017-09-09

上传用户：edisonfather

《器件封装用户向导》赛灵思产品封装资料

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

/dl/32374.html

标签： 封装器件用户赛灵思

上传时间： 2013-10-22

上传用户：ztj182002

《器件封装用户向导》赛灵思产品封装资料

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

/dl/39540.html

标签： 封装器件用户赛灵思

上传时间： 2013-11-21

上传用户：不懂夜的黑

The emphasis of this book is on real-time application of Synopsys tools, used to combat various pro

The emphasis of this book is on real-time application of Synopsys tools, used to combat various problems seen at VDSM geometries. Readers will be exposed to an effective design methodology for handling complex, submicron ASIC designs. Significance is placed on HDL coding styles, synthesis and optimi ...

/dl/461290.html

标签： application real-time Synopsys emphasis

上传时间： 2017-07-05

上传用户：waitingfy

ESD Program Management

Electrostatic discharge  (ESD)  events  can  have serious detrimental effects  on  the manufacture  and  performance of microelectronic devices, the systems that contain them,  and  the manufacturing facilities used  to produce them. Submicron d ...

/dl/522254.html

标签： Management Program ESD

上传时间： 2020-06-05

上传用户：shancjb

ESD Protection in CMOS ICs

在互補式金氧半(CMOS)積體電路中，隨著量產製程的演進，元件的尺寸已縮減到深次微米(deep-submicron)階段，以增進積體電路(IC)的性能及運算速度，以及降低每顆晶片的製造成本。但隨著元件尺寸的縮減，卻出現一些可靠度的問題。在次微米技術中，為了克服所謂熱載子(Hot-Carrier)問題而發展出 LDD(Lightly-Doped Drain) 製 ...

/dl/522257.html

标签： Protection CMOS ESD ICs in

上传时间： 2020-06-05

上传用户：shancjb

ESD_Technology

在互補式金氧半(CMOS)積體電路中，隨著量產製程的演進，元件的尺寸已縮減到深次微米(deep-submicron)階段，以增進積體電路(IC)的性能及運算速度，以及降低每顆晶片的製造成本。但隨著元件尺寸的縮減，卻出現一些可靠度的問題。 ...

/dl/522261.html

标签： ESD_Technology

上传时间： 2020-06-05

上传用户：shancjb

Submicron 7条

按分类查找:

Fluid Flow in Micron and Submicron Size Channels

《器件封装用户向导》赛灵思产品封装资料

《器件封装用户向导》赛灵思产品封装资料

The emphasis of this book is on real-time application of Synopsys tools, used to combat various pro

ESD Program Management

ESD Protection in CMOS ICs

ESD_Technology

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