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CHIP 518

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  • Thermal+Management+of+Telecommunications+Equipment

    The need to develop reliable microelectronic devices capable of operating at high speeds with complex functionality requires a better understanding of the factors that govern the thermal performance of electronics. With an increased demand on system reliability and performance combined with miniatur ...

    /dl/522164.html

    标签: Telecommunications Management Equipment Thermal of

    上传时间: 2020-06-01

    上传用户:shancjb

  • Wireless+Communication+Circuits+and+Systems

    This book is concerned with integrated circuits and systems for wireless and mobile communications. Circuit techniques and implementation of reconfigurable low-voltage and low-power single-chip CMOS transceivers for multiband and multi- mode universal wireless communications are the focus of the boo ...

    /dl/522206.html

    标签: Communication Wireless Circuits Systems and

    上传时间: 2020-06-01

    上传用户:shancjb

  • Electrostatic Discharge Protection

    Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing t ...

    /dl/522246.html

    标签: Electrostatic Protection Discharge

    上传时间: 2020-06-05

    上传用户:shancjb

  • ESD_protection_for_RF_and_AMS_ICs

    This paper reviews key factors to practical ESD protection design for RF and analog/mixed-signal (AMS) ICs, including general challenges emerging, ESD-RFIC interactions, RF ESD design optimization and prediction, RF ESD design characterization, ESD-RFIC co-design technique, etc. Practical design exa ...

    /dl/522259.html

    标签: ESD_protection_for_RF_and_AMS_ICs

    上传时间: 2020-06-05

    上传用户:shancjb

  • Basic ESD Design Guidelines

    ESD is a crucial factor for integrated circuits and influences their quality and reliability. Today increasingly sensitive processes with deep sub micron structures are developed. The integration of more and more functionality on a single chip and saving of chip area is required. Integrated circuits ...

    /dl/522265.html

    标签: Guidelines Design Basic ESD

    上传时间: 2020-06-05

    上传用户:shancjb

  • Power+Electronic+Modules+Design+Manufacture

    A power semiconductor module is basically a power circuit of different materials assembled together using hybrid technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organ ...

    /dl/522342.html

    标签: Manufacture Electronic Modules Design Power

    上传时间: 2020-06-07

    上传用户:shancjb

  • Wireless Identification

    We are in the era of ubiquitous computing in which the use and development of Radio Frequency Iden- tification (RFID) is becoming more widespread. RFID systems have three main components: readers, tags, and database. An RFID tag is composed of a small microchip, limited logical functionality, and an ...

    /dl/522404.html

    标签: Identification Wireless

    上传时间: 2020-06-08

    上传用户:shancjb

  • MAX1447

    MAX1447  3.5- and 4.5-Digit, Single-Chip ADCs with LED Drivers

    /dl/523031.html

    标签: 1447 MAX

    上传时间: 2020-11-12

    上传用户:

  • 永嘉原厂技术支持:LCD液晶驱动芯片兼用HT16C22 LQFP52/48

    深圳市永嘉微电科技有限公司,原厂直销!原装现货更有优势!工程服务,技术支持,让您的生产高枕无忧!量大价优,保证原装。您有量,我有价! 联系人:许先生               联系手机:188 9858 2398 (微信)    &n ...

    /dl/742585.html

    标签: LCD驱动IC 液晶驱动芯片 抗干扰驱动芯片 显示屏驱动IC

    上传时间: 2021-04-03

    上传用户:szqxw1688

  • SOP28封装的LCD液晶驱动显示芯片VK1072B

    产品型号:VK1072B 产品品牌:VINKA/永嘉微电 封装形式: SOP28 联 系 人:沈经理 联 系 QQ:288 521 8966  联系手机:13554744703 提供专业工程服务,用芯服务客户-F03 概述:VK1072B 是一个18×4的LCD驱动器,可软件配置使其适用于各种LCD应用,仅用3条信号线便可控制LCD驱动器,也可通过指令使其进入 ...

    /dl/742724.html

    标签: 1072B 1072 SOP LCD 28 VK 封装 液晶驱动 显示芯片

    上传时间: 2021-07-12

    上传用户:abcyyim0921