The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.
The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum ...
介绍了SoPC（System on a Programmable Chip）系统的概念和特点，给出了基于PLB总线的异步串行通信（UART）IP核的硬件设计和实现。通过将设计好的UART IP核集成到SoPC系统中加以验证，证明了所设计的UART IP核可以正常工作。该设计方案为其他基于SoPC系统IP核的开发提供了一定的参考。
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The NXP LPC314x combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, three channel10-bit A/D, and a myriad of serial and parallel interfaces in a single chip targeted atconsumer, industrial, medical, and communication mark ...
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU ...
On the LPC13xx, programming, erasure and re-programming of the on-chip flash can be performed using In-System Programming (ISP) via the UART serial port, and also, can be performed using In-Application Programming (IAP) calls directed by the end-user code. For In-System Programming (ISP) via the UAR ...
The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, in ...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
