As economy explodesand packaging industry lfourishes，itisacriticalissue thatinternational
communityencountersthewasteofresourcesandenvironmentalpollution causedbypackaging waste．
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on b ...
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel
Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to
enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements
include higher drive capability, 5 V I/O tolerance, l ...
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel
Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to
enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements
include higher drive capability, 5 V I/O toleran ...
The PCA9535 and PCA9535C are 24-pin CMOS devices that provide 16 bits of GeneralPurpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and wasdeveloped to enhance the NXP Semiconductors family of I2C-bus I/O expanders. Theimprovements include higher drive capability, 5 V I/O t ...
The PCA9555 is a 24-pin CMOS device that provides 16 bits of General Purpose parallelInput/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed toenhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvementsinclude higher drive capability, 5 V I/O tolerance, lo ...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
